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SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE
    描述
    Bonder/Semi Die Bonder Any spare parts sets?: No
    配置
    無配置
    OEM 代工型號說明
    Flip Chip Bonder
    文檔

    無文檔

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    verified-listing-icon

    已驗證

    類別
    Flip Chip Bonders

    上次驗證: 30 天前

    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    110586

    晶圓尺寸:

    未知

    年份:

    未知

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders
    年份: 0條件: 翻新的
    上次驗證28 天前
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders
    年份: 0條件: 二手
    上次驗證30 天前
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders
    年份: 0條件: 二手
    上次驗證30 天前

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    verified-listing-icon
    已驗證
    類別
    Flip Chip Bonders
    上次驗證: 30 天前
    listing-photo-f864f0847eb5467bb93e64cd595cc9eb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80283/f864f0847eb5467bb93e64cd595cc9eb/3728e0b8ad7140018c35af062c2436d2_5779789513ae43fbaf2083f8c7508faf1201a_mw.jpeg
    listing-photo-f864f0847eb5467bb93e64cd595cc9eb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80283/f864f0847eb5467bb93e64cd595cc9eb/2449d0c5d23c4be684d8751e782842b8_cba3f707765c4e0a9bd88a22d72b2fa41201a_mw.jpeg
    listing-photo-f864f0847eb5467bb93e64cd595cc9eb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80283/f864f0847eb5467bb93e64cd595cc9eb/e6ea1db23f0c455f848e96bac7bae0ff_855a3648c1cc460482317cd0431f7e85_mw.jpeg
    listing-photo-f864f0847eb5467bb93e64cd595cc9eb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80283/f864f0847eb5467bb93e64cd595cc9eb/820c9463190142759d20e03789a4f4d7_6817fb6a3fa9441fb1d7b2b4793a42231201a_mw.jpeg
    listing-photo-f864f0847eb5467bb93e64cd595cc9eb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80283/f864f0847eb5467bb93e64cd595cc9eb/254486130e1b44c2b2c3c20dd1c0980c_2a95c724f2c84c368d3c013d85521e681201a_mw.jpeg
    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    110586

    晶圓尺寸:

    未知

    年份:

    未知

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Bonder/Semi Die Bonder Any spare parts sets?: No
    配置
    無配置
    OEM 代工型號說明
    Flip Chip Bonder
    文檔

    無文檔

    類似上架商品
    查看全部
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders年份: 0條件: 翻新的上次驗證:28 天前
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders年份: 0條件: 二手上次驗證:30 天前
    SEMICONDUCTOR EQUIPMENT CORP. (SEC) 860 EAGLE

    SEMICONDUCTOR EQUIPMENT CORP. (SEC)

    860 EAGLE

    Flip Chip Bonders年份: 0條件: 二手上次驗證:30 天前