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描述
無描述配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 代工型號說明
Flip Chip Bonder文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
Installed / Running
產品編號:
110112
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
Installed / Running
產品編號:
110112
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 代工型號說明
Flip Chip Bonder文檔
無文檔