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描述
Repair needed - Z axis bond head not moving Any spare parts sets?: Yes配置
無配置OEM 代工型號說明
Flip Chip Bonder文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111137
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111137
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Repair needed - Z axis bond head not moving Any spare parts sets?: Yes配置
無配置OEM 代工型號說明
Flip Chip Bonder文檔
無文檔