描述
Universal Bonder配置
無配置OEM 代工型號說明
Universal Flip Chip Die Bonder - most versatile semi-automatic Flip-Chip Platform文檔
無文檔
JFP MICROTECHNIC
PP6
已驗證
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
70562
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
JFP MICROTECHNIC
PP6
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
70562
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Universal Bonder配置
無配置OEM 代工型號說明
Universal Flip Chip Die Bonder - most versatile semi-automatic Flip-Chip Platform文檔
無文檔