描述
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mm配置
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM 代工型號說明
未提供文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150786
晶圓尺寸:
未知
年份:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FINETECH INC
FINEPLACER femto 2
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150786
晶圓尺寸:
未知
年份:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mm配置
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM 代工型號說明
未提供文檔
無文檔