描述
Flip Chip Bonder配置
無配置OEM 代工型號說明
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
135133
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
8800 FC QUANTUM hs
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
135133
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Bonder配置
無配置OEM 代工型號說明
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000文檔
無文檔