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描述
videos attached below配置
無配置OEM 代工型號說明
As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs FlipChip Bonder文檔
PREFERRED
SELLER
類別
Flip Chip Bonders
上次驗證: 超過60天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
64812
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
BESI / DATACON
8800 CHAMEO advanced
類別
Flip Chip Bonders
上次驗證: 超過60天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
64812
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available