We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
無描述配置
無配置OEM 代工型號說明
The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.文檔
無文檔
類似上架商品
查看全部
TERADYNE
microFLEX
類別
Final Test
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
99840
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.文檔
無文檔