描述
無描述配置
EDS/ TESTOEM 代工型號說明
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.文檔
無文檔
TERADYNE
CATALYST
已驗證
類別
Final Test
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116761
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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查看全部TERADYNE
CATALYST
類別
Final Test
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116761
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
EDS/ TESTOEM 代工型號說明
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.文檔
無文檔