概述

B6700D uses a high-capacity power supply that delivers a maximum of 256 amps per burn-in board - twice that of the first-generation B6700 tester. In addition, it has twice the driver pin resources as its predecessor, enabling it to reach higher testing frequencies and efficiency. It can also maintain or increase parallelism to keep throughput high as the number of stacked NAND die per package increases in the future. Additionally, the B6700D's oven can replicate operating conditions while controlling temperature in 0.1 ℃ increments.