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LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    描述
    Lam 2300 EXELAN Flex Chamber only
    配置
    無配置
    OEM 代工型號說明
    The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
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    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

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    已驗證

    類別
    Etch/Asher

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    81935


    晶圓尺寸:

    12"/300mm


    年份:

    2005

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    Logistics Support
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    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    LAM RESEARCH CORPORATION 2300 EXELAN FLEX

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    Etch/Asher
    年份: 0條件: 二手
    上次驗證超過60天前

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    verified-listing-icon
    已驗證
    類別
    Etch/Asher
    上次驗證: 超過60天前
    listing-photo-03186b945f1a466f9e7756710731d100-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/48608/03186b945f1a466f9e7756710731d100/d5b12df024f94429a04b11b49be34029_f0037038bff1463bb5e50182aa94de351201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    81935


    晶圓尺寸:

    12"/300mm


    年份:

    2005


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Lam 2300 EXELAN Flex Chamber only
    配置
    無配置
    OEM 代工型號說明
    The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
    文檔

    無文檔

    類似上架商品
    查看全部
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    Etch/Asher年份: 0條件: 二手上次驗證: 超過60天前
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    Etch/Asher年份: 2005條件: 二手上次驗證: 超過60天前
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    Etch/Asher年份: 0條件: 二手上次驗證: 超過60天前