描述
Tackiness Tester配置
無配置OEM 代工型號說明
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.文檔
無文檔
MALCOM
TK-1
已驗證
類別
Electronic Test
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59369
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MALCOM
TK-1
類別
Electronic Test
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59369
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tackiness Tester配置
無配置OEM 代工型號說明
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.文檔
無文檔