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ADVANTEST R6245
  • ADVANTEST R6245
描述
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/
配置
Communication Server PCB Board - Grande - PCB Assembly Manufacture
OEM 代工型號說明
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs
文檔

無文檔

類別
Electronic Test

上次驗證: 超過60天前

關鍵商品詳情

條件:

New


作業狀態:

未知


產品編號:

70544


晶圓尺寸:

未知


年份:

2023


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ADVANTEST

R6245

verified-listing-icon
已驗證
類別
Electronic Test
上次驗證: 超過60天前
listing-photo-12cabe443b4e4746ac1ec1018d8b5b18-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52477/12cabe443b4e4746ac1ec1018d8b5b18/e2094c9b7ad64030a234bab9763747a6_tda7293parallelmodular_mw.png
關鍵商品詳情

條件:

New


作業狀態:

未知


產品編號:

70544


晶圓尺寸:

未知


年份:

2023


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/
配置
Communication Server PCB Board - Grande - PCB Assembly Manufacture
OEM 代工型號說明
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs
文檔

無文檔