描述
無描述配置
Cu Plating.OEM 代工型號說明
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.文檔
無文檔
SEMITOOL
LT-210
已驗證
類別
Electro Plating
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
34499
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
LT-210
已驗證
類別
Electro Plating
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
34499
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Cu Plating.OEM 代工型號說明
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.文檔
無文檔