描述
METAL (CU)配置
METAL (CU)OEM 代工型號說明
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文檔
無文檔
LAM RESEARCH / NOVELLUS
SABRE EXTREME
已驗證
類別
Electro Plating
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91060
晶圓尺寸:
12"/300mm
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE EXTREME
已驗證
類別
Electro Plating
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91060
晶圓尺寸:
12"/300mm
年份:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
METAL (CU)配置
METAL (CU)OEM 代工型號說明
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文檔
無文檔