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LAM RESEARCH / NOVELLUS SABRE
    描述
    ECD (Electro Chemical Deposition)
    配置
    無配置
    OEM 代工型號說明
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
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    LAM RESEARCH / NOVELLUS

    SABRE

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    已驗證

    類別

    Electro Plating
    上次驗證: 超過30天前
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    條件:

    Used


    作業狀態:

    未知


    產品編號:

    88736


    晶圓尺寸:

    12"/300mm


    年份:

    未知

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    LAM RESEARCH / NOVELLUS SABRE
    LAM RESEARCH / NOVELLUSSABREElectro Plating
    年份: 0條件: 二手
    上次驗證超過30天前

    LAM RESEARCH / NOVELLUS

    SABRE

    verified-listing-icon

    已驗證

    類別

    Electro Plating
    上次驗證: 超過30天前
    listing-photo-dce60a99823b48158f06ad7f7278c36c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    88736


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    ECD (Electro Chemical Deposition)
    配置
    無配置
    OEM 代工型號說明
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    文檔

    無文檔

    類似上架商品
    查看全部
    LAM RESEARCH / NOVELLUS SABRE
    LAM RESEARCH / NOVELLUS
    SABRE
    Electro Plating年份: 0條件: 二手上次驗證: 超過30天前
    LAM RESEARCH / NOVELLUS SABRE
    LAM RESEARCH / NOVELLUS
    SABRE
    Electro Plating年份: 0條件: 二手上次驗證: 超過30天前
    LAM RESEARCH / NOVELLUS SABRE
    LAM RESEARCH / NOVELLUS
    SABRE
    Electro Plating年份: 0條件: 二手上次驗證: 超過60天前