描述
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): Yes配置
無配置OEM 代工型號說明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文檔
無文檔
類別
Electro Plating
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
136171
晶圓尺寸:
8"/200mm
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
類別
Electro Plating
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
136171
晶圓尺寸:
8"/200mm
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): Yes配置
無配置OEM 代工型號說明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文檔
無文檔