描述
ECD (Electro Chemical Deposition)配置
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 代工型號說明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文檔
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LAM RESEARCH / NOVELLUS
SABRE 3D
已驗證
類別
Electro Plating
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56903
晶圓尺寸:
12"/300mm
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
已驗證
類別
Electro Plating
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56903
晶圓尺寸:
12"/300mm
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ECD (Electro Chemical Deposition)配置
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 代工型號說明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文檔
無文檔