描述

RFL02 SemiGEAR Reflow Tool NEXX STRATUS S300-FX ELECTROPLATING TOOL with ANCOSYS AUTOMATED ANALYSIS AND DOSING Unit

配置

-Software Version: Standard -CIM: SECS GEM -Process: Plating metals Cu, Ni, Au, Sn, Ag -Main System: ANCOSYS AUTOMATED ANALYSIS AND DOSING (1)

OEM 代工型號說明

Stratus stands out as the top-tier solution for pattern plating and TSV applications, merging remarkable yield with cost-efficiency. Its ShearPlate technology simplifies process tuning, addressing the core challenges of production electrodeposition and ensuring unparalleled deposition uniformity. Catering to a range of applications from TSV to advanced packaging, Stratus' vertical design boasts up to 20 plating positions, guaranteeing high throughput and reduced maintenance. With its modular structure, Stratus is customizable to fit specific needs, available in two models - S200 and S300, and stands as the plating industry's gold standard for performance and adaptability. ShearPlate technology ensures a uniform and thin fluid boundary layer, crucial for deposition uniformity and a wide chemical operating window in TSV and pattern plating. Stratus' vertical architecture, offering up to 20 metal plating positions, enables high throughput and system flexibility. Maintenance costs are minimized as Stratus requires only a single motion axis supported by magnetic bearings, unlike competing tools with multiple axes and mechanical bearings. The modular architecture of Stratus allows for optimized system layouts tailored to specific process and throughput needs, from R&D to high-throughput production. It is available in two models, S200 (150/200 mm) and S300 (200/300 mm), each offering two configurations (FX with up to 10 plating cells and DX with up to 4 plating cells). Stratus sets the benchmark for performance, efficiency, and versatility in the plating industry."