描述
無描述配置
ECD310 UI HDD & Manual included, Riader310 basically but 8 inch conversioned. 2 x Cassette LP, 3 x Stack SRD, 7 x ECD(CFD3), Previous Process (Ni, SnAg)OEM 代工型號說明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文檔
無文檔
類別
Electro Plating
上次驗證: 今日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
138240
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
類別
Electro Plating
上次驗證: 今日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
138240
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
ECD310 UI HDD & Manual included, Riader310 basically but 8 inch conversioned. 2 x Cassette LP, 3 x Stack SRD, 7 x ECD(CFD3), Previous Process (Ni, SnAg)OEM 代工型號說明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文檔
無文檔