描述
Wet processing system配置
(Qty 2) FOUP Factory Interface Mainframe Raider Robot Handler Process: Cu Plating Software Version: 3.0.0.20 CIM: SECS/GEMOEM 代工型號說明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文檔
無文檔
類別
Electro Plating
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154783
晶圓尺寸:
12"/300mm
年份:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
類別
Electro Plating
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154783
晶圓尺寸:
12"/300mm
年份:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wet processing system配置
(Qty 2) FOUP Factory Interface Mainframe Raider Robot Handler Process: Cu Plating Software Version: 3.0.0.20 CIM: SECS/GEMOEM 代工型號說明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文檔
無文檔