描述
Cu Plating (TIV) [CoW_L]配置
無配置OEM 代工型號說明
Advanced electrochemical deposition (electroplating) system made by Applied Materials (AMAT) for semiconductor wafer-level packaging and 3D chip architectures.文檔
無文檔
類別
Electro Plating
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
151383
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
NOKOTA VMax 2 ECD
類別
Electro Plating
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
151383
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Cu Plating (TIV) [CoW_L]配置
無配置OEM 代工型號說明
Advanced electrochemical deposition (electroplating) system made by Applied Materials (AMAT) for semiconductor wafer-level packaging and 3D chip architectures.文檔
無文檔