描述
無描述配置
SCCMOEM 代工型號說明
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.文檔
無文檔
TEL / TOKYO ELECTRON
UNITY
已驗證
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
102895
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
102895
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
SCCMOEM 代工型號說明
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.文檔
無文檔