描述
Poly/RIE(NV/Step)配置
Poly/RIE(NV/Step)OEM 代工型號說明
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.文檔
無文檔
TEL / TOKYO ELECTRON
TACTRAS
已驗證
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97975
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部TEL / TOKYO ELECTRON
TACTRAS
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97975
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Poly/RIE(NV/Step)配置
Poly/RIE(NV/Step)OEM 代工型號說明
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.文檔
無文檔