描述
Surface Tech Sys (STS) STS Multiplex DRIE Tool (Bosch Process) Description: Loaklock, single wafer process, manual load/unload. Typical Application: ICP，DRIE Gases: N2, CH4, H2, O2, Ar, SF6, CL2, N2, SiCl4, N2 Chuck: ESC type Wafer Size: 4 inch . Capable upgrade for up to 6 inch or 8 inch配置
無配置OEM 代工型號說明
未提供文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 18 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138682
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
STS
ASE ICP DRIE
類別
Dry / Plasma Etch
上次驗證: 18 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138682
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Surface Tech Sys (STS) STS Multiplex DRIE Tool (Bosch Process) Description: Loaklock, single wafer process, manual load/unload. Typical Application: ICP，DRIE Gases: N2, CH4, H2, O2, Ar, SF6, CL2, N2, SiCl4, N2 Chuck: ESC type Wafer Size: 4 inch . Capable upgrade for up to 6 inch or 8 inch配置
無配置OEM 代工型號說明
未提供文檔
無文檔