描述
SAMCO RIE 10 NR – SAMCO RIE 10NR Reactive Ion Etch System | Dry Etching System / Tool with Thermo Electron Thrmoflex 900 Chiller Reactive Ion Etching System RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage. Etching is performed with minimum sidewall deterioration and a high selectivity between materials. With its sleek, compact design, the RIE-10NR system requires minimal clean room space. Dimensions: Main Unit: 500(W) x 920(D) x 1510(H) mm Pump Unit: 522(W) x 163(D) x 216(H) mm Features: Highly selective anisotropic etching Fully automatic “one-button” operation with full manual override Easy-to-use computerized touch panel for parameter control, recipe entry and storage Process wafers up to ø8″ in diameter Sleek, compact design uses minimal clean room space Applications: Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo Manufacturing of micromachines Failure analysis配置
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SAMCO
RIE-10N
類別
Dry / Plasma Etch
上次驗證: 7 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138673
晶圓尺寸:
未知
年份:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
SAMCO RIE 10 NR – SAMCO RIE 10NR Reactive Ion Etch System | Dry Etching System / Tool with Thermo Electron Thrmoflex 900 Chiller Reactive Ion Etching System RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage. Etching is performed with minimum sidewall deterioration and a high selectivity between materials. With its sleek, compact design, the RIE-10NR system requires minimal clean room space. Dimensions: Main Unit: 500(W) x 920(D) x 1510(H) mm Pump Unit: 522(W) x 163(D) x 216(H) mm Features: Highly selective anisotropic etching Fully automatic “one-button” operation with full manual override Easy-to-use computerized touch panel for parameter control, recipe entry and storage Process wafers up to ø8″ in diameter Sleek, compact design uses minimal clean room space Applications: Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo Manufacturing of micromachines Failure analysis配置
無配置OEM 代工型號說明
未提供文檔
無文檔