描述
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines配置
無配置OEM 代工型號說明
未提供文檔
無文檔
SAMCO
200C
類別
Dry / Plasma Etch
上次驗證: 7 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138665
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines配置
無配置OEM 代工型號說明
未提供文檔
無文檔