描述
Dry etching machine配置
無配置OEM 代工型號說明
Plasma Source: ICP Plasma Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He ) Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.) Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only) Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only) Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.] N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / min文檔
無文檔
PANASONIC
E600L
已驗證
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
108765
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PANASONIC
E600L
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
108765
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Dry etching machine配置
無配置OEM 代工型號說明
Plasma Source: ICP Plasma Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He ) Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.) Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only) Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only) Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.] N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / min文檔
無文檔