LAM RESEARCH CORPORATION

TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.

LAM RESEARCH CORPORATION

TCP 9600

Dry / Plasma Etch

類似上架商品

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

TCP 9600

Dry / Plasma Etch

類似上架商品

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600

LAM RESEARCH CORPORATION

TCP 9600