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LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
描述
ETCH
配置
無配置
OEM 代工型號說明
TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.
文檔

無文檔

類別
Dry / Plasma Etch

上次驗證: 16 天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

124941


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

TCP 9600

verified-listing-icon
已驗證
類別
Dry / Plasma Etch
上次驗證: 16 天前
listing-photo-8f66f0c6d22b45138206fec3007f0e97-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

124941


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ETCH
配置
無配置
OEM 代工型號說明
TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.
文檔

無文檔