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LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
描述
Polycrystal dry etching machine
配置
無配置
OEM 代工型號說明
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.
文檔

無文檔

類別
Dry / Plasma Etch

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

112598


晶圓尺寸:

6"/150mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

TCP 9400

verified-listing-icon
已驗證
類別
Dry / Plasma Etch
上次驗證: 超過60天前
listing-photo-2c1c2fa0b1a94697add18ebc0e70926c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

112598


晶圓尺寸:

6"/150mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Polycrystal dry etching machine
配置
無配置
OEM 代工型號說明
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.
文檔

無文檔