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LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
描述
Rainbow 4428
配置
無配置
OEM 代工型號說明
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
文檔

無文檔

類別
Dry / Plasma Etch

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

105886


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
Available

LAM RESEARCH CORPORATION

RAINBOW 4400

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已驗證
類別
Dry / Plasma Etch
上次驗證: 超過60天前
listing-photo-665163dbe4104823b6ba5a837639ad74-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

105886


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Rainbow 4428
配置
無配置
OEM 代工型號說明
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
文檔

無文檔