描述
LAM Rainbow 4526I配置
LAM Rainbow 4526I - Plasma Etch 200mm convertible: Yes Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 40 x 98 x 81 Bypack2 weight (kg): 150OEM 代工型號說明
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
132395
晶圓尺寸:
6"/150mm
年份:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
RAINBOW 4500
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
132395
晶圓尺寸:
6"/150mm
年份:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
LAM Rainbow 4526I配置
LAM Rainbow 4526I - Plasma Etch 200mm convertible: Yes Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 40 x 98 x 81 Bypack2 weight (kg): 150OEM 代工型號說明
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.文檔
無文檔