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描述
無描述配置
Process: Cu Ox Software Version: 1.8.4 SP17 HF7 Number of Loadports: 3 -Chm/Unit Position 1: Exelan 23EX1771 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 2 Exelan 23EX1772 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 3 Exelan 23EX1773 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 4 Exelan 23EX1774 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100OEM 代工型號說明
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
130002
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN FLEX
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
130002
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Process: Cu Ox Software Version: 1.8.4 SP17 HF7 Number of Loadports: 3 -Chm/Unit Position 1: Exelan 23EX1771 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 2 Exelan 23EX1772 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 3 Exelan 23EX1773 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 4 Exelan 23EX1774 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100OEM 代工型號說明
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.文檔
無文檔