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APPLIED MATERIALS (AMAT) P5000 ETCH
    描述
    CVD Dx l SACVD TEOS
    配置
    無配置
    OEM 代工型號說明
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    文檔

    無文檔

    類別
    Dry / Plasma Etch

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    126132


    晶圓尺寸:

    4"/100mm, 6"/150mm, 8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    verified-listing-icon
    已驗證
    類別
    Dry / Plasma Etch
    上次驗證: 超過60天前
    listing-photo-f3f134f8d0ae40b5a3b43127a6ccee3d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    126132


    晶圓尺寸:

    4"/100mm, 6"/150mm, 8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    CVD Dx l SACVD TEOS
    配置
    無配置
    OEM 代工型號說明
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    文檔

    無文檔

    類似上架商品
    查看全部