跳到主要內容
Moov logo

Moov Icon
APPLIED MATERIALS (AMAT) P5000 ETCH
    描述
    無描述
    配置
    AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangers
    OEM 代工型號說明
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    文檔

    無文檔

    類別
    Dry / Plasma Etch

    上次驗證: 超過30天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    128736


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    verified-listing-icon
    已驗證
    類別
    Dry / Plasma Etch
    上次驗證: 超過30天前
    listing-photo-b9a97c44149942868c778a897d0af762-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/79830/b9a97c44149942868c778a897d0af762/23eedad11c7a44e3b741a3729785e9d9_d24144b069e44f13a8f39aa2c349593459be5af0230446d29b45c22789a38ce8f_mw.jpeg
    listing-photo-b9a97c44149942868c778a897d0af762-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/79830/b9a97c44149942868c778a897d0af762/b0f476f0dcd04e5e8be8c56e27c62b86_dab57e144147417ca1f67487d00168a1172c7ceb8f824a40a39419efd90d34f4f_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    128736


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangers
    OEM 代工型號說明
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    文檔

    無文檔

    類似上架商品
    查看全部