
描述
無描述配置
AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM 代工型號說明
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128736
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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P5000 ETCH
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128736
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM 代工型號說明
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文檔
無文檔