We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
無描述配置
Wafer EtchingOEM 代工型號說明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129915
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129915
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Wafer EtchingOEM 代工型號說明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.文檔
無文檔