
描述
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and door配置
無配置OEM 代工型號說明
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 18 天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
139659
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部APPLIED MATERIALS (AMAT)
CENTURA MxP
類別
Dry / Plasma Etch
上次驗證: 18 天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
139659
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and door配置
無配置OEM 代工型號說明
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.文檔
無文檔