描述
Vintage: 2018 Status: Installed and running Condition: Complete and working. No missing parts. Availability: Immediate release配置
Wafer Size: 150mm Process: ICP (Chlorine etch) Chamber Type: x3 DTM Etch (Cl) chambers Chamber Body Type: DPS Chamber Process: Metal Etch Load Lock / Cassette Configuration: 6" Peek Robot: Blade 6" & 8" Robot w/window Pump: Pump Turbo, Heater, STP-A1603C, Seiko Keiki Type: B75100030OEM 代工型號說明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
125355
晶圓尺寸:
6"/150mm
年份:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA II
類別
Dry / Plasma Etch
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
125355
晶圓尺寸:
6"/150mm
年份:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Vintage: 2018 Status: Installed and running Condition: Complete and working. No missing parts. Availability: Immediate release配置
Wafer Size: 150mm Process: ICP (Chlorine etch) Chamber Type: x3 DTM Etch (Cl) chambers Chamber Body Type: DPS Chamber Process: Metal Etch Load Lock / Cassette Configuration: 6" Peek Robot: Blade 6" & 8" Robot w/window Pump: Pump Turbo, Heater, STP-A1603C, Seiko Keiki Type: B75100030OEM 代工型號說明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."文檔
無文檔