描述
無描述配置
無配置OEM 代工型號說明
2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.文檔
無文檔
DISCO
DDS2300
已驗證
類別
Die Sorters & Attachers
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63989
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DDS2300
已驗證
類別
Die Sorters & Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63989
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.文檔
無文檔