描述
無描述配置
1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutesOEM 代工型號說明
Sort to Tape Reel at up to 16,500 UPH文檔
無文檔
BESI / DATACON
CS 1250
已驗證
類別
Die Sorters & Attachers
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13921
晶圓尺寸:
未知
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
CS 1250
已驗證
類別
Die Sorters & Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13921
晶圓尺寸:
未知
年份:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutesOEM 代工型號說明
Sort to Tape Reel at up to 16,500 UPH文檔
無文檔