Datacon Technology is a manufacturer of flip chip bonding, multichip die bonding and other related assembly equipment.

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing. 

BESI / DATACON

2200 EVO

The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.

2200 APM

The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.

2200 EVO plus

The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging.

The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers.

Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.

2200 APM+

CS 1250

The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.

DS9000e

The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

2200 EVO hS

The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi. With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements. While significantly increasing the accuracy and placement capabilities the Datacon 2200 evo advanced does not forget its roots in the Multi Module Attach family. It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for.

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