The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



AD8312FC

20230208213641.png

9EB456CA-99FF-4FE7-8A4E-B5FBC74A1409_1_201_a.jpeg

81DFADB7-0932-416C-A862-99BFFC6D6100_1_201_a.jpeg

FBC8BA45-8789-487E-9911-111EB9362746.jpeg

36A2FC28-2D68-46BF-822C-26761816199B_1_201_a.jpeg

 standard 12" wafe flip chip bonder configuration, conditional very good

AD8312FC

類別

概述

活躍中的上架商品

服務

最熱門的上架商品

利用 Moov 將其上架並立即找到完美的買家。