跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon

AD8312FC

概述

The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.

活躍中的上架商品

2

服務

檢驗、保險、評估、物流

最熱門的上架商品

有類似商品?
利用 Moov 將其上架並立即找到完美的買家。