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ASM AD8312FC
    描述
    standard 12" wafe flip chip bonder configuration, conditional very good
    配置
    slot magazine (pick head )onload, flip chip module ,slot offload, standard configuration
    OEM 代工型號說明
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
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    ASM

    AD8312FC

    verified-listing-icon

    已驗證

    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    59681


    晶圓尺寸:

    12"/300mm


    年份:

    2017


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    ASM AD8312FC

    ASM

    AD8312FC

    Die Bonders / Sorters / Attachers
    年份: 2017條件: 二手
    上次驗證超過60天前

    ASM

    AD8312FC

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 超過60天前
    listing-photo-8b5c7a4d04a84f9499be98b6fa8b8041-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/32280/8b5c7a4d04a84f9499be98b6fa8b8041/a8ac44080f834d03a763a348741d4b9e_img20220507113416edit379933094991183_mw.jpg
    listing-photo-8b5c7a4d04a84f9499be98b6fa8b8041-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/32280/8b5c7a4d04a84f9499be98b6fa8b8041/55e000026ad241fd96834c4f27a0b0c1_img20220507083310edit380017020438034_mw.jpg
    listing-photo-8b5c7a4d04a84f9499be98b6fa8b8041-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/32280/8b5c7a4d04a84f9499be98b6fa8b8041/86e85ac3b8be4e6885d81d01675b2918_img20220507101511edit379970780437647_mw.jpg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    59681


    晶圓尺寸:

    12"/300mm


    年份:

    2017


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    standard 12" wafe flip chip bonder configuration, conditional very good
    配置
    slot magazine (pick head )onload, flip chip module ,slot offload, standard configuration
    OEM 代工型號說明
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
    文檔

    無文檔

    類似上架商品
    查看全部
    ASM AD8312FC

    ASM

    AD8312FC

    Die Bonders / Sorters / Attachers年份: 2017條件: 二手上次驗證:超過60天前
    ASM AD8312FC

    ASM

    AD8312FC

    Die Bonders / Sorters / Attachers年份: 2015條件: 二手上次驗證:超過60天前