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AD898

概述

it’s a new generation Die Bonder of ASM. It is fully automatic die bonding machine with up to 8” wafer capability. It is fully flexible in handling wide range of die size and leadframe/substrate. Package conversion can be carried out quickly and easily. The AD898 is equipped with fast and reliable linear bond head, high accuracy linear motor indexer platform, high speed Eagle Pattern Recognition System with pre/post bond inspection, 2-in-1 epoxy writer system.

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