描述
Die Bonder配置
ASM AD898CCOEM 代工型號說明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文檔
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ASM
AD898
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115805
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD898
類別
Die Bonders / Sorters / Attachers
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115805
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die Bonder配置
ASM AD898CCOEM 代工型號說明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文檔
無文檔