描述
無描述配置
Gripper type.Eutectic Die Bonder. Magazine to MagazineOEM 代工型號說明
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.文檔
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NEWPORT
MRSI 705
已驗證
類別
Die Bonders
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107675
晶圓尺寸:
未知
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NEWPORT
MRSI 705
類別
Die Bonders
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107675
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Gripper type.Eutectic Die Bonder. Magazine to MagazineOEM 代工型號說明
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.文檔
無文檔