描述
Condition: Complete / No known issues Status: Deinstalled配置
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM 代工型號說明
Die Bonder文檔
無文檔
BESI / ESEC
2008 xP
已驗證
類別
Die Bonders
上次驗證: 23 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105323
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2008 xP
類別
Die Bonders
上次驗證: 23 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105323
晶圓尺寸:
未知
年份:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Condition: Complete / No known issues Status: Deinstalled配置
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM 代工型號說明
Die Bonder文檔
無文檔