描述
無描述配置
無配置OEM 代工型號說明
MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder文檔
PANASONIC
MD-P200
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
75482
晶圓尺寸:
未知
年份:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PANASONIC
MD-P200
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
75482
晶圓尺寸:
未知
年份:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available