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PANASONIC MD-P200
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    文檔

    PANASONIC

    MD-P200

    verified-listing-icon

    已驗證

    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    75482


    晶圓尺寸:

    未知


    年份:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers
    年份: 2021條件: 二手
    上次驗證超過60天前

    PANASONIC

    MD-P200

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 超過60天前
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/f2c2b545d6f242f59e9ae8bc9650b48b_6b890de09d78403f9b99bf3f1ad95ed91201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3ec38e71dbba4aee885d96cd09065bcc_0716f6aa56384f5b8231f110776cfeb345005c_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/c7e6e16ba1884f168d8fa14e5afd09e0_23f9b896e19c40979ea27b96236e2faa1201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/e97984aa302041b692970336a3004012_41bd8b999aa84e06ba3d2281b6ae11251201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3a5b24a12cf34962beedcff4ebe8184e_991ae0c8a99d4fe7b96ddef22c7e791745005c_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    75482


    晶圓尺寸:

    未知


    年份:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    文檔
    類似上架商品
    查看全部
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers年份: 2021條件: 二手上次驗證:超過60天前
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers年份: 2022條件: 二手上次驗證:超過60天前