描述
Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta Rotation配置
無配置OEM 代工型號說明
Die Bonder文檔
無文檔
KULICKE & SOFFA (K&S)
6496
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
21401
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
6496
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
21401
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta Rotation配置
無配置OEM 代工型號說明
Die Bonder文檔
無文檔